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Principle of lead frame

Release time:09,13,2022   Readings:313

Lead frame as a carrier of integrated circuit chips, is a kind of with the aid of bonding material (wire, aluminum wire, copper wire) for chip internal circuit weak outside the terminal and the electrical connection in the lead, the formation of the electric circuits of the key parts, which serve as the bridge between the external and wire connection, the vast majority of semiconductor integrated block you need to use lead frame, It is an important basic material in the electronic information industry.